YAG laser thin film processing system
Can be used for various applications! Such as patterning of organic devices and cutting of metal wiring for ICs, etc.
We provide a YAG laser thin film processing system that is widely used for semiconductor development, failure analysis, and repair applications such as FPD. It offers stable, high-quality laser irradiation at both high and low power, significantly reducing the impact on the substrate and surrounding areas, and enabling high-quality laser processing on materials different from conventional ones. **Main Applications:** - Removal of protective films and organic thin films using DUV lasers - Cutting and removal of IC metal wiring such as gold and aluminum, exposing underlying patterns - Drilling for EB testers and probing - Pre-treatment for FIB (such as pre-processing), pre-treatment for SEM, TEM, etc. (such as marking) - Precise transfer of laser marks from the back surface of samples to the front using failure analysis equipment - Simple photomask creation and photomask modification - Correction of various defects in FPDs: CF protrusion correction, OC foreign matter protrusion correction, ITO short cutting, etc. - Direct patterning on organic films and correction of pattern collapse - Spot annealing - Integration into electrical measurement systems for defect and failure analysis, etc. We can customize and provide integration into various devices such as semi-auto systems and probers for a wide range of applications.
- Company：TNSシステムズ
- Price：Other
